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PRODUCT
Products
Galden® HS260 – Fully Fluorinated Fluids for Vapor Phase Soldering (VPS)
Product Number：Galden® LS200 LS215 LS230 HS240 HS260
[Operating Temperature]
Up to 260°C
Up to 260°C
[Operating Temperature]
Up to 260°C
Galden® HS260 Vapor Phase Soldering Fluids
Galden® PFPE LS200 LS215 LS230 HS240 HS260
Galden® LS/HS Vapor Phase Soldering Fluids
Galden® LS/HS is a family of fully fluorinated fluids specifically designed for vapor phase soldering (VPS) processes. Their narrow molecular weight distribution, combined with the exceptionally strong carbon-fluorine bonds and flexible ether linkages, makes Galden® LS/HS ideal for VPS.
CF3 – (OCFCF2)n – (OCF2)m – OCF3
CF3
| FEATURES | BENEFITS |
| Multiple grades available with different boiling points | Widest working temperature range to optimize VPS processes |
| Narrow molecular weight distribution | Maximum process stability and repeatability No boiling point drift |
| Low heat of vaporization Vapor density higher than air |
Rapid, residue-free drying Preheating and heating steps occur in an inert atmosphere |
| Excellent thermal and chemical stability Good material compatibility |
Non-corrosive and non-reactive with construction materials No formation of decomposition residues |
| No flash point or fire point No auto-ignition point Non-explosive |
Enhanced safety Safe use at high temperatures |
Vapor Phase Soldering and Lead-Free Solder Alloys
RoHS (Restriction of Hazardous Substances) regulations emphasize the importance of reducing lead content and have driven manufacturers to develop and offer lead-free systems.
Lead-free printed circuit boards (PCBs) have played a key role in this transition. Traditionally, solder consisted of approximately 60% tin (Sn) and 40% lead (Pb). Modern lead-free solders use tin alloyed with silver (Ag), copper (Cu), and bismuth (Bi). The melting point of traditional Sn/Pb solder is around 180 °C, while lead-free solders melt at about 227 °C, presenting a challenge for PCB manufacturers.
In addition to the higher soldering temperature, the miniaturization of devices like smartphones and wearables has led to more complex and densely packed PCBs. These include IC substrates with heterogenous packaging, small chips, and critical heating considerations. Galden® LS and HS fluids provide ideal solutions for all these challenges through vapor phase soldering.
Due to their narrow molecular weight distribution, Galden® LS and HS enable VPS with several advantages over alternative technologies:
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Precise temperature control based on the fluid's boiling point
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No shadowing effects typical of convection and radiation heating
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Accurate and uniform heat transfer that prevents overheating and reduces tombstoning
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Short soldering times that reduce mechanical and thermal stress on components
Why Choose Galden® LS and HS for Vapor Phase Soldering?
Galden® LS and HS fluids offer the optimal solution for lead-free soldering processes because:
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They are fully compliant with RoHS regulations
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They have zero ozone depletion potential (ODP)
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They offer the widest operating temperature range, up to 260 °C, to support lead-free soldering
Typical Properties at 25 °C
Typical Properties |
Units |
HS260 VPS Fluids |
|---|---|---|
| Boiling Point | °C | 260 |
| Density | g/cm3 | 1.83 |
| Kinematic viscosity | cSt | 7.00 |
| Vapor pressure | Pa | 1 |
| Specific heat | J/Kg·°C | 973 |
| Heat of vap. at boiling point | J/g | 63 |
| Thermal conductivity | W/m·°C | 0.07 |
| Coefficient of expansion | cm3/cm3·°C | 0.0011 |
| Surface tension | dyne/cm | 20 |
| Dielectric strength | kV (2.54 mm gap) | 40 |
| Dielectric constant | - | 2.1 |
| Volume resistivity | Ohm-cm | 1015 |
| Average molecular weight | amu | 1,210 |